aluminum heat sink 150mm: 1050A aluminium, tolerance ±0.20 mm, surface clear anodize Type II, 5-10 µm, lead time 12 working days, MOQ 2000 pcs. Capacity 800,000 pcs for 1U server and AI accelerator. Drawing review and first-article report included.
aluminum heat sink for seeed studio xiao: pure copper C110, tolerance ±0.10 mm, surface black anodize Type II, 10-15 µm, lead time 12 working days, MOQ 1000 pcs. Capacity 300,000 pcs for switch-mode power supply. Drawing review and first-article report included.
ssd heat sink: copper-alloy CuZn37, tolerance ±0.20 mm, surface black anodize Type II, 10-15 µm, lead time 15 working days, MOQ 1000 pcs. Capacity 120,000 pcs for IGBT power module. Drawing review and first-article report included.
heat sink for m.2 ssd: pure copper C110, tolerance ±0.15 mm, surface zinc-nickel plating, trivalent passivation, lead time 10 working days, MOQ 5000 pcs. Capacity 300,000 pcs for industrial PLC and control cabinet. Drawing review and first-article report included.
aluminum heat sink: 6063-T5 aluminium, tolerance ±0.10 mm, surface zinc-nickel plating, trivalent passivation, lead time 20 working days, MOQ 500 pcs. Capacity 50,000 pcs for 1U server and AI accelerator. Drawing review and first-article report included.
