heat sink compound thermal paste: 6063-T5 aluminium, 0.8 mm fins at 3.0 mm pitch, 0.15 mm over 100 mm flatness, 0.35 K/W thermal resistance. MOQ 200 pcs, shi...
heat sink compound thermal paste
heat sink compound thermal paste: 6063-T5 aluminium, 0.8 mm fins at 3.0 mm pitch, 0.15 mm over 100 mm flatness, 0.35 K/W thermal resistance. MOQ 200 pcs, shi...
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The heat sink compound thermal paste is a stamped 6063-T5 aluminium part with 3.0 mm fin pitch, 0.8 mm stock, and a 40 x 40 x 22 mm envelope. It holds 0.15 mm flatness over 100 mm on the mounting face and achieves 0.35 K/W thermal resistance. Fin pitch stays within ±0.03 mm across a 50,000 pcs run, verified at CMM 0.001 mm resolution.
Key Takeaway
The heat sink compound thermal paste is a stamped 6063-T5 aluminium part with 3.0 mm fin pitch, 0.8 mm stock, and 40 x 40 x 22 mm envelope, holding 0.15 mm flatness over 100 mm on the mounting face. Thermal resistance is 0.35 K/W, verified at CMM 0.001 mm resolution, with fin pitch held within ±0.03 mm across a 50,000 pcs run.
The heat sink compound thermal paste combines 3.0 mm fin pitch with 0.8 mm stock in 6063-T5 aluminium, so 40 x 40 x 22 mm parts keep 0.15 mm over 100 mm on the mounting face. Thermal resistance is 0.35 K/W, measured at CMM 0.001 mm resolution per lot.
Stamping gives a repeatable 0.8 mm fin profile that extrusion cannot hold: the die forms every fin in one stroke, so pitch stays within ±0.03 mm across a 50,000 pcs run.
Stamped construction tolerates batch variation better than extrusion: die wear shows up first as a measurable shift in fin pitch, which inspection catches at CMM 0.001 mm resolution rather than in the field.
One supplier now covers 0.8 mm to 0.8 mm fin gauges from the same 110 T press family, so a thermal redesign is a tooling change rather than a new vendor.
Pressing 6063-T5 aluminium keeps the heat sink compound thermal paste light, from 650 g depending on envelope, without sacrificing fin density, which matters where airflow path length is already fixed by the enclosure.
Every stroke is dimensionally identical, so ±0.15 mm hole position carries across the batch. That is what makes EV and OBC charger volume programs repeatable.
Material Selection and Surface Finish
The standard material is 6063-T5 aluminium, supplied with clear anodize Type II, 5-10 µm. For applications where EV and OBC charger exposure is a concern, we recommend the passivated route; where conductivity matters more than weight, copper C110 raises thermal performance and roughly doubles unit mass.
General dimensions run to ±0.15 mm, with critical features such as ±0.05 mm on mounting hole position held separately. Formed geometry inherits tooling repeatability of ±0.03 mm, and hole position is held to ±0.15 mm. Tighter classes need an extra press operation, so it is worth deciding before tooling rather than after.
Inspection Before Every Shipment
Flatness is checked on a granite surface plate, 25 °C against a 0.15 mm over 100 mm limit, and fin pitch is verified optically at ±0.03 mm. Reports go out with each lot.
Sampling is AQL 0.65 for critical dimensions and 1.5 for general, with CMM 0.001 mm resolution on every first article. Deviations beyond ±0.15 mm trigger a full-lot sort.
Flatness is measured on granite rather than on cast iron, because 0.15 mm over 100 mm at 40 x 40 x 22 mm reads differently on a plate that has not been lapped. Records keep both readings.
Final containment is PE bag + export carton, 20 kg per carton. Every carton is labelled with lot, quantity and inspection status, and the record is kept for 10 years against the ISO9001 file.
Where This Part Is Used
EV and OBC charger programs are the reason this geometry exists. Where the enclosure cannot grow taller, fin density is the only lever, and 3.0 mm pitch with 0.8 mm stock is the practical ceiling for aluminium.
EV and OBC charger customers typically specify 6063-T5 aluminium for corrosion reasons and then hold the drawing to ±0.15 mm. The 50,000 pcs line absorbs the volume without a second source.
Where a heat sink compound thermal paste runs at EV and OBC charger volumes, part-to-part consistency decides field returns. ±0.03 mm on a 50,000 pcs run keeps the thermal curve inside one band.
Designers working on EV and OBC charger ask for flatness before they ask for thermal data, because EV and OBC charger assembly is automated and a non-flat base stops the line.
Specifications
Parameter
Value / Range
Material
6063-T5 aluminium
Fin thickness
0.8 mm
Fin pitch
3.0 mm
Fin height
50 mm
Base thickness
1.0 mm
Base flatness
0.15 mm over 100 mm
Thermal resistance
0.35 K/W
Thermal test condition
ΔT = 60 K, natural convection
Surface finish
clear anodize Type II, 5-10 µm
Size range
40 x 40 x 22 mm
FAQ: Your Questions Before Ordering
Which materials do you recommend?
6063-T5 aluminium is the standard choice. For EV and OBC charger in a corrosive environment we specify 6063-T5 with clear anodize Type II, 5-10 µm; for the highest conductivity we move to copper C110, which raises cost and weight but drops thermal resistance by roughly half at the same envelope.
Do you test for thermal resistance?
We test at ΔT = 60 K, natural convection and report 0.35 K/W. That is a steady-state figure, not a transient: for EV and OBC charger first-power-on behaviour you need a different test, and we can run it on request.
How long does tooling last before replacement?
On 6063-T5 aluminium at normal press tonnage, expect a tooling life of roughly . At 50,000 pcs that is 6 to 12 months. We keep spare die sets on site for EV and OBC charger programs, which removes the wait if wear shows up in the flatness record.
Can you deliver without surface treatment?
Yes, we ship as-pressed for customers who do their own finishing. The risk is handling marks on 0.8 mm fins, so we pack those parts with interleaving sheets inside PE bag + export carton, 20 kg per carton.
The plant is ISO9001 certified, and parts ship with RoHS and REACH declarations on request. Third-party SGS inspection can be arranged before the container is sealed, which is what most EV and OBC charger buyers specify.
Source-direct from Dongguan: coil stock, forming, surface treatment and inspection happen in one building, so 0.15 mm over 100 mm flatness is verified before the part is packed.
The factory holds ISO9001 and can ship RoHS and REACH documentation with the PE bag + export carton, 20 kg per carton. Third-party SGS inspection is arranged on request before the container is sealed.
±0.03 mm fin pitch; ±0.15 mm hole position; 0.15 mm over 100 mm mounting face
Lead time
Standard for this process: 2–4 weeks after tooling approval
MOQ
Standard for this process: 5,000 pcs
Capacity
50,000 pcs run; 110 T press family
Selection / comparison
Option
Best for
Trade-off
Stamped 0.8 mm fin profile
Repeatable 3.0 mm fin pitch in high-volume EV and OBC charger programs
Tooling change required for thermal redesign
Extruded fin profile
Lower tooling cost for simple profiles
Cannot hold 0.8 mm fin profile or ±0.03 mm pitch repeatably
6063-T5 aluminium
Lightweight heat sink compound thermal paste from 650 g
Lower thermal conductivity than copper
CMM 0.001 mm inspection
Catching die wear as a measurable fin pitch shift
Adds per-lot inspection time
110 T press family
0.8 mm to 0.8 mm fin gauges from one supplier
Limited to press envelope and tonnage
Process / inspection
Stage
Control
Record
Stamping
Die forms every fin in one stroke; pitch within ±0.03 mm
Stroke dimensional record per lot
Fin profile
0.8 mm fin profile held by die
Profile measurement per lot
Mounting face
0.15 mm over 100 mm flatness
CMM 0.001 mm resolution report
Hole position
±0.15 mm across batch
CMM 0.001 mm resolution report
Thermal performance
0.35 K/W thermal resistance
Measured at CMM 0.001 mm resolution per lot
Final shipment
Inspection before every shipment
Lot inspection record
Frequently Asked Questions
What is the thermal resistance of the heat sink compound thermal paste?
The heat sink compound thermal paste measures 0.35 K/W thermal resistance. This is verified at CMM 0.001 mm resolution per lot, so the 40 x 40 x 22 mm part with 3.0 mm fin pitch and 0.8 mm stock delivers consistent thermal performance across a 50,000 pcs run.
What material and fin pitch does this heat sink use?
It uses 6063-T5 aluminium with a 3.0 mm fin pitch and 0.8 mm stock. The stamped construction holds pitch within ±0.03 mm across a 50,000 pcs run, which extrusion cannot match for this 0.8 mm fin profile.
How flat is the mounting face on the heat sink compound thermal paste?
The mounting face holds 0.15 mm over 100 mm. This flatness is maintained on 40 x 40 x 22 mm parts and checked at CMM 0.001 mm resolution per lot, supporting repeatable contact in EV and OBC charger volume programs.
Can stamped construction hold tighter fin pitch than extrusion?
Yes. Stamping gives a repeatable 0.8 mm fin profile that extrusion cannot hold. The die forms every fin in one stroke, so 3.0 mm pitch stays within ±0.03 mm across a 50,000 pcs run, and die wear shows up as a measurable pitch shift caught at CMM 0.001 mm resolution.
What is the weight of the heat sink compound thermal paste?
Pressing 6063-T5 aluminium keeps the heat sink compound thermal paste light, from 650 g depending on envelope, without sacrificing fin density. This matters where airflow path length is already fixed by the enclosure in 40 x 40 x 22 mm designs.
How is hole position controlled across a production batch?
Every stroke is dimensionally identical, so ±0.15 mm hole position carries across the batch. This repeatability is what makes EV and OBC charger volume programs reliable, with inspection before every shipment at CMM 0.001 mm resolution.
What press capacity and fin gauges are available from one supplier?
One supplier now covers 0.8 mm to 0.8 mm fin gauges from the same 110 T press family. That means a thermal redesign is a tooling change rather than a new vendor, supporting 3.0 mm fin pitch and 0.35 K/W thermal resistance in 50,000 pcs runs.
Key Specifications and Selection Guide
Spec comparison
Parameter
Value / Range
Material
6063-T5 aluminium
Tolerance
Fin pitch ±0.03 mm; flatness 0.15 mm over 100 mm
Lead time
Standard for this process: 2–4 weeks after tooling approval
MOQ
Standard for this process: 5,000 pcs
Capacity
50,000 pcs run demonstrated
Selection / comparison
Option
Best for
Trade-off
Stamped 0.8 mm fin
Repeatable fin pitch within ±0.03 mm over 50,000 pcs
Tooling change required for fin gauge changes
Extruded fin
Lower tooling cost for simple profiles
Cannot hold 0.8 mm fin profile; pitch varies more
6063-T5 aluminium
Thermal resistance 0.35 K/W with 3.0 mm pitch
Material-specific thermal performance
CMM 0.001 mm inspection
Verifying flatness 0.15 mm and pitch ±0.03 mm
Adds inspection time per lot
Frequently Asked Questions
What is the fin pitch tolerance for the heat sink compound thermal paste?
The fin pitch is held within ±0.03 mm across a 50,000 pcs run. This is verified at CMM 0.001 mm resolution per lot, ensuring repeatable 3.0 mm fin pitch for consistent thermal performance.
Thermal resistance is 0.35 K/W. This is achieved with 6063-T5 aluminium, 0.8 mm stock, and 3.0 mm fin pitch in a 40 x 40 x 22 mm envelope, measured at CMM 0.001 mm resolution.
What flatness can you hold on the mounting face?
We hold 0.15 mm flatness over 100 mm on the mounting face. This is inspected at CMM 0.001 mm resolution, ensuring proper contact for thermal paste application.
Why choose stamped construction over extrusion for this heat sink?
Stamping gives a repeatable 0.8 mm fin profile that extrusion cannot hold. The die forms every fin in one stroke, so pitch stays within ±0.03 mm across a 50,000 pcs run, and die wear shows up as a measurable shift caught at CMM 0.001 mm resolution.
Standard lead time is 2–4 weeks after tooling approval, with an MOQ of 5,000 pcs. Capacity is demonstrated at 50,000 pcs runs, and one supplier covers 0.8 mm fin gauges from the same 110 T press family.
The part is made from 6063-T5 aluminium with 0.8 mm stock. This material and thickness support the 3.0 mm fin pitch and 0.35 K/W thermal resistance in the 40 x 40 x 22 mm envelope.
How is the heat sink compound thermal paste inspected before shipment?
Inspection before every shipment includes CMM verification at 0.001 mm resolution for fin pitch ±0.03 mm and flatness 0.15 mm over 100 mm. Thermal resistance is verified per lot at 0.35 K/W.