This High Power IGBT Heat Sink is a CNC-machined aluminum or copper base plate designed to pull 300 W to 2,500 W of heat away from IGBT modules in inverters, motor drives, and EV chargers. You get a f
This High Power IGBT Heat Sink is a CNC-machined aluminum or copper base plate designed to pull 300 W to 2,500 W of heat away from IGBT modules in inverters, motor drives, and EV chargers. You get a flatness tolerance of 0.02 mm across the mounting surface, a 5-day lead time for prototypes, and a surface hardness of 45 HRC when hard-anodized. It is precision manufacturing from BQUQ, made in China, with no MOQ for your first order.
The mounting surface is machined on a 5-axis CNC center to a flatness of 0.02 mm over 300 mm length. This prevents air gaps between the IGBT module and the heat sink, which is critical because even a 0.05 mm gap can raise junction temperature by 15°C. We use a single-point diamond fly cutter to achieve a surface finish of Ra 0.8 µm. This is not a stamped or extruded part—every fin and channel is milled from solid 6061-T6 aluminum or C1100 copper.
Choose between pin fin arrays (3 mm diameter, 8 mm pitch) for omnidirectional airflow or straight channel fins (2.5 mm wide, 12 mm deep) for ducted cooling. Our thermal simulation shows a thermal resistance of 0.05 °C/W for a 300 mm x 300 mm copper pin fin version. For higher power, we machine a vapor chamber slot into the base plate—depth accuracy is ±0.05 mm. The fin height can go up to 80 mm without deformation, thanks to our 12,000 RPM spindle and rigid fixturing.
We apply Type III hard anodizing to the aluminum version, which gives a surface hardness of 45 HRC and a dielectric breakdown voltage of 800 V. The coating thickness is 25 µm ± 5 µm, measured with an eddy current gauge on every batch. This layer resists corrosion in salt spray tests for 336 hours (ASTM B117). For copper versions, we apply a nickel-plated finish—5 µm thick—to prevent oxidation and maintain solderability for direct IGBT mounting.
We pre-install stainless steel threaded inserts (M4, M5, M6) for IGBT module screws. The true position of these holes is held to 0.05 mm, so your module aligns perfectly without stress on the DBC substrate. Counterbore depths are controlled to ±0.03 mm to ensure screw heads sit flush. If you use through-holes instead, we deburr both sides with a 0.2 mm chamfer—no sharp edges that can cut cable insulation during assembly.
Send a STEP or IGES file, and we machine a single prototype in 5 days. Because this is precision manufacturing with no MOQ, you can order just one unit for testing or 10,000 units for production. Our factory in Dongguan runs 24/7 with 40 CNC machines, so we batch your parts with similar heat sinks to reduce cost. For a 200 mm x 200 mm aluminum pin fin heat sink, the unit price drops from $45 (qty 1) to $18 (qty 500).
Every heat sink ships with a material certificate (EN 10204 3.1) confirming 6061-T6 aluminum or C1100 copper composition. We also include a thermal resistance test report measured on our custom test rig—not just a simulation. The report shows temperature rise at 50 W, 100 W, and 200 W with a 0.5 m/s airflow. This data helps your thermal engineer validate system performance without running your own tests. We keep a sample of each batch for 12 months for traceability.
If you solder the IGBT directly to the heat sink, we provide a bare copper surface with Ra 0.4 µm and a flatness of 0.01 mm—solder voids are reduced to under 2% as verified by X-ray inspection. If you use thermal paste, we apply a matte bead-blasted finish (Ra 1.6 µm) that increases paste adhesion and prevents pump-out. For clip mounting, we machine a dovetail groove with a 0.02 mm parallelism tolerance. All options are available on the same base design—just specify in your drawing.
| Specification | Value | Notes |
|---|---|---|
| Material | 6061-T6 Aluminum / C1100 Copper | Other alloys on request |
| Base Plate Size | 50 x 50 mm to 600 x 400 mm | Custom sizes no extra tooling |
| Fin Height | Up to 80 mm | Pin or straight fin |
| Flatness (Mounting Surface) | 0.02 mm over 300 mm | Measured on granite plate |
| Surface Finish | Ra 0.4 µm to 1.6 µm | Depends on mounting method |
| Hard Anodize Thickness | 25 µm ± 5 µm | 45 HRC hardness |
| Threaded Inserts | M3 to M8, stainless steel | True position 0.05 mm |
| Tolerance (General) | ±0.02 mm | Hole positions ±0.05 mm |
| Lead Time (Prototype) | 5 days | Production 15-20 days |
| MOQ | No minimum | Single piece accepted |
Before we cut metal, our thermal engineer runs a steady-state FEA simulation using your IGBT power loss, coolant flow rate, and ambient temperature. We model the junction-to-case thermal resistance and adjust fin density and base thickness accordingly. For example, a 600 V/600 A IGBT module with 1,200 W loss needs a copper base thickness of 12 mm and a fin pitch of 6 mm—we give you this recommendation in the quote. This service is free for all inquiries, and the FEA report is included with the final heat sink.
With a 0.05 °C/W thermal resistance and forced air at 3 m/s, you can keep IGBT junction temperature below 125°C even at 1,500 W continuous power.
Yes, we machine any footprint from your 2D or 3D drawing, including non-standard hole patterns and odd base plate shapes.
We do not supply consumables, but we machine dovetail grooves or clip slots to your specified spring clip dimensions.
We stress-relieve the aluminum before machining and apply a final skim cut after anodizing to restore the 0.02 mm flatness, which is verified on a granite table.
Send your drawing or IGBT module datasheet to sc@bquq.com or WhatsApp +86 13713157787. We will respond within 12 hours with a firm unit price, lead time, and a preliminary thermal simulation result. For best results, reference our CNC cutting tool selection guide to specify your fin finish, and check our CNC machining tolerances guide to define your flatness and hole position requirements. No MOQ, no minimum order quantity—just send your drawing and we will start the precision manufacturing process today.
| Parameter | Capability |
|---|---|
| Materials | AL6063/6061/5052, pure copper C1100, copper-aluminum composite |
| Process | Extrusion, CNC machining, skiving, forging, die casting, stamping fins |
| Fin Types | Extruded, pin fin, skived, folded, bonded, heat pipe, vapor chamber |
| Surface | Black anodizing, clear anodizing, nickel plating, powder coating |
| Size Range | Max 1500 x 400 x 300 mm |
| Thermal Test | Thermal resistance and heat dissipation data per batch |
| Prototype | 5-7 days, no MOQ on samples |
| Inspection | CMM, thermal resistance tester, full report per batch |
