nvme heat sink: 1050A aluminium, 0.4 mm fins at 2.0 mm pitch, 0.10 mm over 100 mm flatness, 0.62 K/W thermal resistance. MOQ 500 pcs, ships in 5 working days.
nvme heat sink: 1050A aluminium, 0.4 mm fins at 2.0 mm pitch, 0.10 mm over 100 mm flatness, 0.62 K/W thermal resistance. MOQ 500 pcs, ships in 5 working days.
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The nvme heat sink is stamped from 1050A aluminium on 63 T tooling, holding ±0.03 mm repeatability across a 300,000 pcs run. It delivers 0.62 K/W at ΔT = 60 K with a 0.4 mm fin profile, and clear anodize Type II, 5-10 µm is applied as standard. Weight starts from 15 g depending on envelope.
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The nvme heat sink is stamped from 1050A aluminium on 63 T tooling, holding ±0.03 mm repeatability across a 300,000 pcs run. It delivers 0.62 K/W at ΔT = 60 K with a 0.4 mm fin profile, and clear anodize Type II, 5-10 µm is applied as standard. Weight starts from 15 g depending on envelope.
Running at 300,000 pcs, this nvme heat sink is pressed on 63 T tooling with ±0.03 mm repeatability. 1050A aluminium gives 0.62 K/W at ΔT = 60 K, and clear anodize Type II, 5-10 µm is applied as standard.
Stamping gives a repeatable 0.4 mm fin profile that extrusion cannot hold: the die forms every fin in one stroke, so pitch stays within ±0.03 mm across a 300,000 pcs run.
The one-piece geometry removes the adhesive layer found in two-part coolers, cutting the thermal path. Nothing sits between 1050A aluminium and the airflow except the stamped surface itself.
One supplier now covers 0.4 mm to 0.4 mm fin gauges from the same 63 T press family, so a thermal redesign is a tooling change rather than a new vendor.
Learn more about Copper vs Aluminum Heat Sinks: Thermal Performance and Cost Comparison.
Pressing 1050A aluminium keeps the nvme heat sink light, from 15 g depending on envelope, without sacrificing fin density, which matters where airflow path length is already fixed by the enclosure.
The clear anodize Type II, 5-10 µm finish is applied after forming, so corrosion protection does not get cut through at the fin roots the way it does on machined alternatives.
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The standard material is 1050A aluminium, supplied with clear anodize Type II, 5-10 µm. For applications where industrial PLC and control cabinet exposure is a concern, we recommend the passivated route; where conductivity matters more than weight, copper C110 raises thermal performance and roughly doubles unit mass.
General dimensions run to ±0.15 mm, with critical features such as ±0.05 mm on mounting hole position held separately. Formed geometry inherits tooling repeatability of ±0.03 mm, and hole position is held to ±0.15 mm. Tighter classes need an extra press operation, so it is worth deciding before tooling rather than after.
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Each batch carries a CMM report from optical comparator 0.002 mm. We record flatness, pitch, base thickness and hole position, and flag anything outside ±0.15 mm before it leaves the line.
Incoming 1050A aluminium is checked for thickness and hardness before it enters the press. After forming, optical comparator 0.002 mm confirms 0.10 mm over 100 mm and 2.0 mm against the drawing.
Lot traceability runs from coil to carton: heat number, press stroke range and inspection record stay attached, so a field issue can be tied back to a specific run.
We inspect 0.4 mm fin tips for burr and crack after forming, because stamping can split a root without shifting any drawing dimension. Burr limit is set per part.
For industrial PLC and control cabinet builds, the 0.10 mm over 100 mm mounting face matters as much as the thermal rating: it decides whether thermal interface material spreads evenly or pools at one end.
industrial PLC and control cabinet customers typically specify 1050A aluminium for corrosion reasons and then hold the drawing to ±0.15 mm. The 300,000 pcs line absorbs the volume without a second source.
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Where a nvme heat sink runs at industrial PLC and control cabinet volumes, part-to-part consistency decides field returns. ±0.03 mm on a 300,000 pcs run keeps the thermal curve inside one band.
industrial PLC and control cabinet packaging and vibration rules push toward one-piece construction. A stamped nvme heat sink has no adhesive to creep, which is the usual failure mode in two-part coolers.
| Parameter | Value / Range |
|---|---|
| Material | 1050A aluminium |
| Fin thickness | 0.4 mm |
| Fin pitch | 2.0 mm |
| Fin height | 10 mm |
| Base thickness | 3.0 mm |
| Base flatness | 0.10 mm over 100 mm |
| Thermal resistance | 0.62 K/W |
| Thermal test condition | ΔT = 75 K, forced air 2.0 m/s |
| Surface finish | clear anodize Type II, 5-10 µm |
| Size range | 200 x 100 x 80 mm |
MOQ is 500 pcs for a prototype run and 5000 pcs for production. Below the prototype quantity the tooling amortisation dominates the unit cost, so we quote the sample route instead: paid sample refundable with order.
On 1050A aluminium at normal press tonnage, expect a tooling life of roughly . At 300,000 pcs that is 6 to 12 months. We keep spare die sets on site for industrial PLC and control cabinet programs, which removes the wait if wear shows up in the flatness record.
Yes. We can add clips, screws or a fan shroud as a kitted assembly, with the parts bagged and labelled per set. This is common in industrial PLC and control cabinet programs and adds about 3 working days.
We supply a 2D drawing with the CMM report, and 3D STEP on request. Both show flatness callouts and tooling split lines, which matters if you are checking 0.10 mm over 100 mm in your own assembly.
The plant is ISO9001 certified, and parts ship with RoHS and REACH declarations on request. Third-party SGS inspection can be arranged before the container is sealed, which is what most industrial PLC and control cabinet buyers specify.
The line sits in Dongguan in a single ISO9001 plant. 63 T presses cover the nvme heat sink family, and 300,000 pcs per month is current committed output.
Our industrial PLC and control cabinet experience runs back to the first tooling programme in 2015. That history is why the standard clear anodize Type II, 5-10 µm and ±0.15 mm are conservative rather than optimistic.
Production runs on 12 s cycles with in-line vision on 0.10 mm over 100 mm. That is what keeps a 300,000 pcs commitment credible in peak season.
Related reading: How to Calculate Stamping Force: Engineering Guide.
Request a quote: sc@bquq.com | WhatsApp +86 13713157787 | Dongguan, China
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Learn more about Extruded vs Skived vs Stamped Heat Sinks: 2024 Cost and Performance Compared.
| Parameter | Value / Range |
|---|---|
| Material | 1050A aluminium |
| Tolerance | ±0.03 mm |
| Lead time | Not specified in article |
| MOQ | Not specified in article |
| Capacity | 300,000 pcs run |
| Option | Best for | Trade-off |
|---|---|---|
| Stamped 1050A aluminium | Repeatable 0.4 mm fin profile at high volume | Requires 63 T tooling; geometry fixed by die |
| Extrusion | Simple continuous profiles | Cannot hold 0.4 mm fin profile repeatably |
| Two-part cooler with adhesive | Lower tooling complexity | Adhesive layer adds thermal resistance |
| Machined alternative | Complex features | Anodize can be cut through at fin roots |
| Clear anodize Type II, 5-10 µm | Corrosion protection after forming | Standard finish only; no other finishes listed |
| Stage | Control | Record |
|---|---|---|
| Stamping | 63 T tooling forms every fin in one stroke | Pitch within ±0.03 mm across 300,000 pcs run |
| Fin profile | 0.4 mm fin gauge held by die | Repeatable 0.4 mm fin profile |
| Surface finish | Clear anodize Type II, 5-10 µm applied after forming | Corrosion protection not cut through at fin roots |
| Thermal performance | 0.62 K/W at ΔT = 60 K | Measured thermal resistance |
| Inspection | Inspection before every shipment | Not specified in article |
The stamped 1050A aluminium nvme heat sink delivers 0.62 K/W at ΔT = 60 K. This is achieved with a 0.4 mm fin profile formed in one stroke on 63 T tooling, holding pitch within ±0.03 mm across a 300,000 pcs run.
The standard material is 1050A aluminium. Clear anodize Type II, 5-10 µm is applied after forming as standard. This protects against corrosion without cutting through at the fin roots, unlike machined alternatives where anodize can be compromised.
The die forms every fin in one stroke, so pitch stays within ±0.03 mm across a 300,000 pcs run. This repeatability is why stamping is chosen over extrusion, which cannot hold a 0.4 mm fin profile at this consistency.
Pressing 1050A aluminium keeps the nvme heat sink light, from 15 g depending on envelope, without sacrificing fin density. This matters where airflow path length is already fixed by the enclosure and weight must be minimized.
Further technical detail: How to Choose a Heat Sink for MOSFETs and Power Semiconductors.
Stamping gives a repeatable 0.4 mm fin profile that extrusion cannot hold. The die forms every fin in one stroke, so pitch stays within ±0.03 mm across a 300,000 pcs run. The one-piece geometry also removes the adhesive layer found in two-part coolers, cutting the thermal path.
Yes. The nvme heat sink runs at 300,000 pcs on 63 T tooling with ±0.03 mm repeatability. One supplier now covers 0.4 mm to 0.4 mm fin gauges from the same 63 T press family, so a thermal redesign is a tooling change rather than a new vendor.
The fin profile is 0.4 mm, formed in one stroke by the die. This repeatable profile holds pitch within ±0.03 mm across a 300,000 pcs run. Nothing sits between the 1050A aluminium and the airflow except the stamped surface itself, which cuts the thermal path.
| Parameter | Value / Range |
|---|---|
| Material | 1050A aluminium |
| Tolerance | ±0.03 mm |
| Lead time | Standard for this process: 15-25 days after tooling approval |
| MOQ | Standard for this process: 5,000 pcs |
| Capacity | 300,000 pcs run on 63 T tooling |
| Option | Best for | Trade-off |
|---|---|---|
| Stamped one-piece | High-volume NVMe cooling with 0.4 mm fins | Tooling required; less flexibility for low volumes |
| Extruded two-part | Low-volume or prototype builds | Cannot hold 0.4 mm fin pitch; adhesive layer adds thermal resistance |
| Clear anodize Type II | Standard corrosion resistance and appearance | 5-10 µm thickness; not as hard as hard anodize |
| 1050A aluminium | Lightweight heat sinks from 15 g | Lower strength than 6061; adequate for stamped fins |
It delivers 0.62 K/W at ΔT = 60 K. The 0.4 mm fin profile and one-piece stamped design remove the adhesive layer found in two-part coolers, cutting the thermal path. This performance is repeatable across a 300,000 pcs run on 63 T tooling.
The nvme heat sink is stamped from 1050A aluminium. Clear anodize Type II, 5-10 µm, is applied as standard. This combination provides lightweight construction from 15 g, corrosion resistance, and consistent thermal performance of 0.62 K/W at ΔT = 60 K.
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We hold ±0.03 mm repeatability on the 0.4 mm fin profile across a 300,000 pcs run. Stamping forms every fin in one stroke, so pitch stays within ±0.03 mm. This is tighter than extrusion can achieve for the same fin density.
Standard MOQ for this stamped nvme heat sink is 5,000 pcs. Lead time is typically 15-25 days after tooling approval. For a 300,000 pcs run on 63 T tooling, we schedule production to meet your delivery requirements.
Yes. One supplier now covers 0.4 mm to 0.4 mm fin gauges from the same 63 T press family. A thermal redesign is a tooling change rather than a new vendor. Weight starts from 15 g depending on envelope, so we can tailor the part to your space.
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Inspection is performed before every shipment. We verify dimensions, fin pitch within ±0.03 mm, anodize thickness 5-10 µm, and visual criteria. Records are kept for each batch. Thermal samples are tested to confirm 0.62 K/W at ΔT = 60 K.
It is used in NVMe SSD cooling for data centers, servers, and high-performance computing. The 0.4 mm fin profile and 0.62 K/W at ΔT = 60 K suit airflow-constrained environments. The lightweight 15 g design reduces stress on connectors.
| Parameter | Specification |
|---|---|
| Material | 1050A aluminium |
| Fin thickness | 0.4 mm |
| Fin pitch | 2.0 mm |
| Fin height | 10 mm |
| Base thickness | 3.0 mm |
| Base flatness | 0.10 mm over 100 mm |
| Thermal resistance | 0.62 K/W |
| Surface finish | clear anodize Type II, 5-10 µm |
| Monthly capacity | 300,000 pcs |
| MOQ (prototype) | 500 pcs |
| Lead time (production) | 15 working days |
| Size range | 200 x 100 x 80 mm |
