heat sink ps5: pure copper C110, 1.0 mm fins at 2.5 mm pitch, 0.15 mm over 100 mm flatness, 1.10 K/W thermal resistance. MOQ 100 pcs, ships in 5 working days.
heat sink ps5: pure copper C110, 1.0 mm fins at 2.5 mm pitch, 0.15 mm over 100 mm flatness, 1.10 K/W thermal resistance. MOQ 100 pcs, ships in 5 working days.
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The heat sink ps5 is a stamped copper C110 part with 2.5 mm fin pitch, 1.0 mm stock, and 0.15 mm over 100 mm flatness on the mounting face. Thermal resistance is 1.10 K/W, verified by CMM and 100% hydraulic press leak test per lot. A single 160 T stroke forms each part in an 8 s cycle, holding fin pitch within ±0.05 mm across a 300,000 pcs run.
The heat sink ps5 combines 2.5 mm fin pitch with 1.0 mm stock in pure copper C110, so 20 x 20 x 10 mm parts keep 0.15 mm over 100 mm on the mounting face. Thermal resistance is 1.10 K/W, measured at CMM plus 100% hydraulic press leak test per lot.
Stamping gives a repeatable 1.0 mm fin profile that extrusion cannot hold: the die forms every fin in one stroke, so pitch stays within ±0.05 mm across a 300,000 pcs run.
Because the base and fins are pressed as one piece, there is no brazed joint to fail. 0.15 mm over 100 mm flatness on the mounting face is held directly from the tool, which keeps thermal interface contact uniform.
A single 160 T stroke forms the whole heat sink ps5, so part cost stops scaling with complexity. Tooling runs ±0.05 mm, and the 8 s cycle feeds a 300,000 pcs line.
Low fin gauge is where stamping wins: 1.0 mm fins at 2.5 mm pitch give more surface per cubic millimetre than a machined or extruded profile of the same envelope.
One supplier now covers 1.0 mm to 1.0 mm fin gauges from the same 160 T press family, so a thermal redesign is a tooling change rather than a new vendor.
The standard material is pure copper C110, supplied with clear anodize Type II, 5-10 µm. For applications where IGBT power module exposure is a concern, we recommend the passivated route; where conductivity matters more than weight, copper C110 raises thermal performance and roughly doubles unit mass.
Related reading: heat sink paste.
General dimensions run to ±0.15 mm, with critical features such as ±0.05 mm on base thickness held separately. Formed geometry inherits tooling repeatability of ±0.05 mm, and hole position is held to ±0.10 mm. Tighter classes need an extra press operation, so it is worth deciding before tooling rather than after.
Flatness is checked on a granite surface plate, 20 °C against a 0.15 mm over 100 mm limit, and fin pitch is verified optically at ±0.05 mm. Reports go out with each lot.
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Sampling is AQL 0.65 for critical dimensions and 1.5 for general, with CMM plus 100% hydraulic press leak test on every first article. Deviations beyond ±0.15 mm trigger a full-lot sort.
We inspect 1.0 mm fin tips for burr and crack after forming, because stamping can split a root without shifting any drawing dimension. Burr limit is set per part.
Final containment is Anti-static bag + wooden crate over 50 kg. Every carton is labelled with lot, quantity and inspection status, and the record is kept for 10 years against the ISO9001 file.
IGBT power module programs are the reason this geometry exists. Where the enclosure cannot grow taller, fin density is the only lever, and 2.5 mm pitch with 1.0 mm stock is the practical ceiling for aluminium.
Learn more about Cold Plate Pressure Drop: Pump and Flow Sizing.
For IGBT power module builds, the 0.15 mm over 100 mm mounting face matters as much as the thermal rating: it decides whether thermal interface material spreads evenly or pools at one end.
Further technical detail: CNC Machining CAD Checklist: 7 Critical Steps Before You Send Files.
IGBT power module customers typically specify pure copper C110 for corrosion reasons and then hold the drawing to ±0.15 mm. The 300,000 pcs line absorbs the volume without a second source.
In IGBT power module, the base usually doubles as the mounting interface. 1.0 mm with 0.15 mm over 100 mm flat gives a stable surface for the IGBT power module thermal pad.
| Parameter | Value / Range |
|---|---|
| Material | pure copper C110 |
| Fin thickness | 1.0 mm |
| Fin pitch | 2.5 mm |
| Fin height | 15 mm |
| Base thickness | 1.0 mm |
| Base flatness | 0.15 mm over 100 mm |
| Thermal resistance | 1.10 K/W |
| Thermal test condition | ΔT = 60 K, natural convection |
| Surface finish | clear anodize Type II, 5-10 µm |
| Size range | 20 x 20 x 10 mm |
General dimensions run to ±0.15 mm; critical ones such as ±0.05 mm on base thickness are held separately. Formed features inherit tooling repeatability of ±0.05 mm. If your drawing needs tighter, tell us before tooling so we can plan the extra press operation.
Recommended reading: EV High Voltage Contactor Parts Collection.
0.15 mm over 100 mm measured on granite surface plate, 20 °C. This is the number that matters for IGBT power module, because the thermal pad needs even contact. If your assembly needs better, say so and we can add a skim operation.
On pure copper C110 at normal press tonnage, expect a tooling life of roughly . At 300,000 pcs that is 6 to 12 months. We keep spare die sets on site for IGBT power module programs, which removes the wait if wear shows up in the flatness record.
Yes. We can add clips, screws or a fan shroud as a kitted assembly, with the parts bagged and labelled per set. This is common in IGBT power module programs and adds about 3 working days.
Skived fins are milled, so you get thin, tall fins and higher density in a given height, but the cost scales directly with fin area. Stamping gives the same result in one stroke at a much lower unit cost below 300,000 pcs. For IGBT power module in a fixed-height enclosure, stamped is normally the right answer.
Our IGBT power module experience runs back to the first tooling programme in 2015. That history is why the standard clear anodize Type II, 5-10 µm and ±0.15 mm are conservative rather than optimistic.
Production runs on 8 s cycles with in-line vision on 0.15 mm over 100 mm. That is what keeps a 300,000 pcs commitment credible in peak season.
Quality staff sit beside the press, not in a separate room. Deviations on 2.5 mm or 0.15 mm over 100 mm stop the run at the tool rather than at final inspection.
Compare it with Custom Corrugated Fin Heat Sinks.
Request a quote: sc@bquq.com | WhatsApp +86 13713157787 | Dongguan, China
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| Parameter | Value / Range |
|---|---|
| Material | Pure copper C110 |
| Tolerance | ±0.05 mm fin pitch; 0.15 mm over 100 mm flatness |
| Lead time | Standard for this process: 15–25 days after tooling approval |
| MOQ | Standard for this process: 1,000 pcs |
| Capacity | 300,000 pcs run; 8 s cycle on 160 T press |
| Option | Best for | Trade-off |
|---|---|---|
| Stamped copper C110 | High-volume PS5 heatsinks needing 1.0 mm fins at 2.5 mm pitch | Tooling required; less flexible for tiny design changes |
| Extruded aluminum | Low-cost prototypes or low thermal loads | Cannot hold 1.0 mm fin profile; lower thermal conductivity than copper |
| Machined copper | Very low volume or complex 3D shapes | Higher part cost; slower cycle than 8 s stamping |
| Brazed fin assembly | Mixed materials or very tall fins | Brazed joint can fail; extra process step |
| Stamped aluminum | Weight-sensitive, moderate thermal loads | Lower thermal conductivity than C110 copper |
| Stage | Control | Record |
|---|---|---|
| Stamping | 160 T single stroke; ±0.05 mm fin pitch | Tooling log and first-article inspection |
| Flatness | 0.15 mm over 100 mm on mounting face | CMM report per lot |
| Leak test | 100% hydraulic press leak test | Pass/fail log per lot |
| Thermal | 1.10 K/W thermal resistance | Thermal test data per lot |
| Final | Inspection before every shipment | Certificate of conformance |
The heat sink ps5 has a thermal resistance of 1.10 K/W. This is measured on the finished stamped copper C110 part with 2.5 mm fin pitch and 1.0 mm stock. Each lot is verified by CMM and 100% hydraulic press leak test before shipment.
The standard material is pure copper C110. It provides high thermal conductivity for the 1.0 mm fins and 2.5 mm pitch. The base and fins are pressed as one piece from 1.0 mm stock, so there is no brazed joint to fail.
We hold 0.15 mm over 100 mm flatness on the mounting face. This is formed directly from the tool on the 160 T press. The tight flatness keeps thermal interface contact uniform and is checked by CMM per lot.
Further technical detail: CNC Machining Plastics: Delrin, Nylon, PEEK and Acrylic.
Fin pitch is held within ±0.05 mm across a 300,000 pcs run. The stamping die forms every fin in one stroke, so the 2.5 mm pitch remains repeatable. Extrusion cannot hold the 1.0 mm fin profile at this tolerance.
Recommended reading: Skived Heat Sink Design Guide: When to Use This High-Fin-Density Cooling Technology.
A single 160 T stroke forms the whole heat sink ps5 in an 8 s cycle. The line supports a 300,000 pcs run. Tooling runs at ±0.05 mm, so part cost stops scaling with complexity once the die is made.
Compare it with Custom Extruded Aluminum Heatsinks.
Yes. One supplier now covers 1.0 mm to 1.0 mm fin gauges from the same 160 T press family. A thermal redesign is a tooling change rather than a new vendor, which shortens qualification and keeps inspection records consistent.
Every lot gets CMM verification and a 100% hydraulic press leak test. We also check the 0.15 mm over 100 mm flatness on the mounting face and the 1.10 K/W thermal resistance. Records ship with the lot.
| Parameter | Specification |
|---|---|
| Material | pure copper C110 |
| Fin thickness | 1.0 mm |
| Fin pitch | 2.5 mm |
| Fin height | 15 mm |
| Base thickness | 1.0 mm |
| Base flatness | 0.15 mm over 100 mm |
| Thermal resistance | 1.10 K/W |
| Surface finish | clear anodize Type II, 5-10 µm |
| Monthly capacity | 300,000 pcs |
| MOQ (prototype) | 100 pcs |
| Lead time (production) | 12 working days |
| Size range | 20 x 20 x 10 mm |
