custom springfield echcon 4.0c back cover plate: , fins at pitch, flatness, thermal resistance. MOQ 500 pcs, ships in 10 working days.
custom springfield echcon 4.0c back cover plate: , fins at pitch, flatness, thermal resistance. MOQ 500 pcs, ships in 10 working days.
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The custom Springfield Echcon 4.0C back cover plate is a one-piece stamped heatsink with fins and a base flat to 0.05 mm, rated at ΔT = 60 K. It supports medical device builds at monthly output with 10,000 pcs as standard. Fin pitch and low fin gauge give more surface per cubic millimetre than machined or extruded profiles, and the finish is applied after forming to protect fin roots.
The custom Springfield Echcon 4.0C back cover plate is a one-piece stamped heatsink with fins and a base flat to 0.05 mm, rated at ΔT = 60 K. It supports medical device builds at monthly output with 10,000 pcs as standard. Fin pitch and low fin gauge give more surface per cubic millimetre than machined or extruded profiles, and the finish is applied after forming to protect fin roots.
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Our custom springfield echcon 4.0c back cover plate uses with fins and a base flat to . Rated at ΔT = 60 K, it supports medical device builds at monthly output with as standard.
Because the base and fins are pressed as one piece, there is no brazed joint to fail. flatness on the mounting face is held directly from the tool, which keeps thermal interface contact uniform.
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Low fin gauge is where stamping wins: fins at pitch give more surface per cubic millimetre than a machined or extruded profile of the same envelope.
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The one-piece geometry removes the adhesive layer found in two-part coolers, cutting the thermal path. Nothing sits between and the airflow except the stamped surface itself.
One supplier now covers to fin gauges from the same press family, so a thermal redesign is a tooling change rather than a new vendor.
The finish is applied after forming, so corrosion protection does not get cut through at the fin roots the way it does on machined alternatives.
The standard material is , supplied with . For applications where medical device exposure is a concern, we recommend the passivated route; where conductivity matters more than weight, copper C110 raises thermal performance and roughly doubles unit mass.
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General dimensions run to ±0.5 mm, with critical features such as held separately. Formed geometry inherits tooling repeatability of , and hole position is held to . Tighter classes need an extra press operation, so it is worth deciding before tooling rather than after.
Flatness is checked on a against a limit, and fin pitch is verified optically at . Reports go out with each lot.
Sampling is AQL 0.65 for critical dimensions and 1.5 for general, with on every first article. Deviations beyond ±0.5 mm trigger a full-lot sort.
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Lot traceability runs from coil to carton: heat number, press stroke range and inspection record stay attached, so a field issue can be tied back to a specific run.
We inspect fin tips for burr and crack after forming, because stamping can split a root without shifting any drawing dimension. Burr limit is set per part.
medical device programs are the reason this geometry exists. Where the enclosure cannot grow taller, fin density is the only lever, and pitch with stock is the practical ceiling for aluminium.
medical device packaging and vibration rules push toward one-piece construction. A stamped custom springfield echcon 4.0c back cover plate has no adhesive to creep, which is the usual failure mode in two-part coolers.
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medical device designs often run a 2.0 m/s forced-air path. at means medical device can hold its target with fan power below the acoustic limit.
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For medical device prototypes, 10 working days covers drawing review and first article. Production lots move to 15 working days once the capability is signed off.
| Parameter | Value / Range |
|---|---|
| General tolerance | ±0.5 mm |
| MOQ (prototype) | 500 pcs |
| MOQ (production) | 20000 pcs |
| Lead time (prototype) | 10 working days |
| Lead time (production) | 15 working days |
Every lot is inspected with , and the report is included in the shipment. We check , , and hole position against ±0.5 mm. Lot traceability from coil to carton is kept for 10 years.
General dimensions run to ±0.5 mm; critical ones such as are held separately. Formed features inherit tooling repeatability of . If your drawing needs tighter, tell us before tooling so we can plan the extra press operation.
Yes. Standard is . Powder coating to RAL 9005 adds about 0.1 mm to the base; zinc-nickel is better for grounding. Note that any added coating sits between and the airflow, so we do not coat the fin roots.
We supply a 2D drawing with the CMM report, and 3D STEP on request. Both show flatness callouts and tooling split lines, which matters if you are checking in your own assembly.
The key is avoiding a second metal at the wet contact area. We recommend and, where the part touches an aluminium chassis, an isolating washer. Tell us the mating material and we will specify the coating accordingly.
Tooling is built in-house, which is how is held across a programme rather than drifting part by part.
Quality staff sit beside the press, not in a separate room. Deviations on or stop the run at the tool rather than at final inspection.
We quote and hold 500 pcs for sampling. Sampling is , so a first evaluation does not require a production commitment.
Request a quote: sc@bquq.com | WhatsApp +86 13713157787 | Dongguan, China
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| Parameter | Value / Range |
|---|---|
| Material | Aluminum 1050 / 6061, copper C110 optional |
| Tolerance | Flatness 0.05 mm; fin pitch ±0.1 mm; thickness ±0.05 mm |
| Lead time | 15–25 days for tooling; 7–12 days for production |
| MOQ | 10,000 pcs standard; 5,000 pcs for repeat orders |
| Capacity | 500,000 pcs/month across press family |
| Option | Best for | Trade-off |
|---|---|---|
| Stamped one-piece | High-volume medical device builds | Tooling cost upfront; limited to 2D fin profiles |
| Machined heatsink | Low-volume or complex 3D geometries | Higher unit cost; brazed joints can fail |
| Extruded profile | Long straight fins with uniform cross-section | Lower surface area per volume; secondary cutting needed |
| Passivated finish | Medical device exposure concerns | Slightly higher cost; not for high-conductivity needs |
| As-formed finish | General electronics cooling | Less corrosion protection at fin roots |
| Stage | Control | Record |
|---|---|---|
| Stamping | Fin pitch and base flatness held from tool | First-article inspection report |
| Forming | One-piece geometry, no brazed joint | Press log and tool maintenance sheet |
| Surface finish | Applied after forming to protect fin roots | Coating thickness certificate |
| Inspection | Flatness 0.05 mm, ΔT = 60 K verification | Dimensional and thermal test data |
| Shipping | Monthly output 10,000 pcs standard | Packing list and traceability label |
The plate is rated at ΔT = 60 K, meaning it can handle a 60 Kelvin temperature difference between the base and the air. Actual thermal resistance depends on airflow and fin pitch, but the one-piece stamped design removes the adhesive layer found in two-part coolers, cutting the thermal path.
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Yes. Flatness on the mounting face is held directly from the tool at 0.05 mm. Because the base and fins are pressed as one piece, there is no brazed joint to fail, which keeps thermal interface contact uniform and avoids the flatness drift seen on machined alternatives.
A thermal redesign is a tooling change rather than a new vendor. Standard monthly output is 10,000 pcs, and MOQ is 10,000 pcs for new tooling. For repeat orders, MOQ drops to 5,000 pcs. Lead time is 15–25 days for tooling and 7–12 days for production.
The standard material is aluminum 1050 or 6061, with copper C110 optional. For medical device exposure, we recommend the passivated route. The finish is applied after forming, so corrosion protection does not get cut through at the fin roots the way it does on machined alternatives.
Low fin gauge is where stamping wins: fins at pitch give more surface per cubic millimetre than a machined or extruded profile of the same envelope. The one-piece geometry removes the adhesive layer found in two-part coolers, cutting the thermal path. Nothing sits between the fins and the airflow except the stamped surface itself.
Every shipment includes dimensional inspection for flatness 0.05 mm, fin pitch ±0.1 mm, and thickness ±0.05 mm. Thermal verification at ΔT = 60 K is recorded. First-article inspection reports, coating thickness certificates, and press logs are kept for traceability. No certifications are claimed beyond standard process records.
Capacity is 500,000 pcs/month across the same press family. For 10,000 pcs, production lead time is 7–12 days after tooling is approved. Tooling lead time is 15–25 days. One supplier now covers fin gauges from the same press family, so a thermal redesign is a tooling change rather than a new vendor.
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| Parameter | Value / Range |
|---|---|
| Material | Stamped aluminum fin stock (low fin gauge) |
| Tolerance | Base flatness 0.05 mm |
| Lead time | Standard monthly output schedule (per PO) |
| MOQ | 10,000 pcs standard |
| Capacity | Monthly output for medical device builds |
| Option | Best for | Trade-off |
|---|---|---|
| One-piece stamped heatsink | Medical device builds needing 10,000 pcs/month | Fin geometry limited to stamping press family |
| Machined profile | Low-volume or complex 3D fin shapes | Higher cost per part, lower surface per cubic millimetre |
| Extruded profile | Long straight fins in high volume | Less surface per cubic millimetre than stamped fins |
| Two-part bonded cooler | Prototypes or mixed-material designs | Adhesive layer adds thermal resistance and joint risk |
The mounting face is held to 0.05 mm flatness directly from the stamping tool. This keeps thermal interface contact uniform across the base. Because the base and fins are pressed as one piece, there is no brazed joint to fail and no adhesive layer to add thermal resistance.
The custom Springfield Echcon 4.0C back cover plate is rated at ΔT = 60 K. This rating applies to the one-piece stamped design with fins and a base flat to 0.05 mm. The low fin gauge and fin pitch give more surface per cubic millimetre than machined or extruded profiles of the same envelope.
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Standard order quantity is 10,000 pcs. The part supports medical device builds at monthly output. One supplier covers fin gauges from the same press family, so you can scale from prototype to production without changing the manufacturing route.
Stamping wins on fin density: low fin gauge at tight pitch gives more surface per cubic millimetre than a machined or extruded profile of the same envelope. The one-piece geometry removes the adhesive layer found in two-part coolers, cutting the thermal path. Nothing sits between the heat source and the airflow except the stamped surface itself.
The finish is applied after forming to protect fin roots. This order of operations matters because forming first can work-harden thin fins, and applying finish afterward avoids coating damage at the fin roots. The result is a durable stamped surface with no brazed joint or adhesive layer in the thermal path.
Inspection is performed before every shipment. Key checks include base flatness to 0.05 mm, fin pitch and low fin gauge, and finish coverage after forming. Records are kept for the stamping tool, flatness data, fin pitch and gauge, finish process, and final shipment inspection.
It is used in medical device builds. The one-piece stamped heatsink supports monthly output with 10,000 pcs as standard. Its ΔT = 60 K rating and 0.05 mm base flatness suit thermal management where uniform interface contact and high surface area per cubic millimetre are required.
| Parameter | Specification |
|---|---|
| MOQ (prototype) | 500 pcs |
| Lead time (production) | 15 working days |
