1U Server Stamped Fin Heatsink Assembly: 6063-T5 aluminium, 0.3 mm fins at 1.5 mm pitch, 0.05 mm over 100 mm flatness, 0.35 K/W thermal resistance. MOQ 100 p...
1U Server Stamped Fin Heatsink Assembly: 6063-T5 aluminium, 0.3 mm fins at 1.5 mm pitch, 0.05 mm over 100 mm flatness, 0.35 K/W thermal resistance. MOQ 100 p...
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A 1U Server Stamped Fin Heatsink Assembly uses a 2.0 mm base and 0.3 mm fins pressed from 6063-T5 aluminium on 160 T tooling. It holds 0.05 mm over 100 mm and returns 0.35 K/W at ΔT = 60 K, natural convection. Monthly output reaches 300,000 pcs with an 8 s cycle, and fin pitch stays within ±0.03 mm across the run.
A 1U Server Stamped Fin Heatsink Assembly uses a 2.0 mm base and 0.3 mm fins pressed from 6063-T5 aluminium on 160 T tooling. It holds 0.05 mm over 100 mm and returns 0.35 K/W at ΔT = 60 K, natural convection. Monthly output reaches 300,000 pcs with an 8 s cycle, and fin pitch stays within ±0.03 mm across the run.
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A 1U Server Stamped Fin Heatsink Assembly uses a 2.0 mm base and 0.3 mm fins pressed from 6063-T5 aluminium on 160 T tooling. It holds 0.05 mm over 100 mm and returns 0.35 K/W at ΔT = 60 K, natural convection. Monthly output reaches 300,000 pcs with an 8 s cycle, and fin pitch stays within ±0.03 mm across the run.
A 2.0 mm base and 0.3 mm fins define this 1U Server Stamped Fin Heatsink Assembly. Pressed from 6063-T5 aluminium on 160 T tooling, it holds 0.05 mm over 100 mm and returns 0.35 K/W at ΔT = 60 K, natural convection. Monthly output runs at 300,000 pcs.
Stamping gives a repeatable 0.3 mm fin profile that extrusion cannot hold: the die forms every fin in one stroke, so pitch stays within ±0.03 mm across a 300,000 pcs run.
A single 160 T stroke forms the whole 1U Server Stamped Fin Heatsink Assembly, so part cost stops scaling with complexity. Tooling runs ±0.03 mm, and the 8 s cycle feeds a 300,000 pcs line.
Low fin gauge is where stamping wins: 0.3 mm fins at 1.5 mm pitch give more surface per cubic millimetre than a machined or extruded profile of the same envelope.
Stamped construction tolerates batch variation better than extrusion: die wear shows up first as a measurable shift in fin pitch, which inspection catches at CMM 0.001 mm with full report rather than in the field.
Every stroke is dimensionally identical, so ±0.10 mm hole position carries across the batch. That is what makes 1U server and AI accelerator volume programs repeatable.
The standard material is 6063-T5 aluminium, supplied with black anodize Type II, 10-15 µm. For applications where 1U server and AI accelerator exposure is a concern, we recommend the passivated route; where conductivity matters more than weight, copper C110 raises thermal performance and roughly doubles unit mass.
General dimensions run to ±0.10 mm, with critical features such as ±0.03 mm on fin pitch held separately. Formed geometry inherits tooling repeatability of ±0.03 mm, and hole position is held to ±0.10 mm. Tighter classes need an extra press operation, so it is worth deciding before tooling rather than after.
Flatness is checked on a granite surface plate, 25 °C against a 0.05 mm over 100 mm limit, and fin pitch is verified optically at ±0.03 mm. Reports go out with each lot.
Sampling is AQL 0.65 for critical dimensions and 1.5 for general, with CMM 0.001 mm with full report on every first article. Deviations beyond ±0.10 mm trigger a full-lot sort.
Flatness is measured on granite rather than on cast iron, because 0.05 mm over 100 mm at 120 x 80 x 22 mm reads differently on a plate that has not been lapped. Records keep both readings.
Final containment is PE bag + export carton, 20 kg per carton. Every carton is labelled with lot, quantity and inspection status, and the record is kept for 10 years against the ISO9001 file.
1U server and AI accelerator programs are the reason this geometry exists. Where the enclosure cannot grow taller, fin density is the only lever, and 1.5 mm pitch with 0.3 mm stock is the practical ceiling for aluminium.
Where a 1U Server Stamped Fin Heatsink Assembly runs at 1U server and AI accelerator volumes, part-to-part consistency decides field returns. ±0.03 mm on a 300,000 pcs run keeps the thermal curve inside one band.
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1U server and AI accelerator packaging and vibration rules push toward one-piece construction. A stamped 1U Server Stamped Fin Heatsink Assembly has no adhesive to creep, which is the usual failure mode in two-part coolers.
In 1U server and AI accelerator, the base usually doubles as the mounting interface. 2.0 mm with 0.05 mm over 100 mm flat gives a stable surface for the 1U server and AI accelerator thermal pad.
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| Parameter | Value / Range |
|---|---|
| Material | 6063-T5 aluminium |
| Fin thickness | 0.3 mm |
| Fin pitch | 1.5 mm |
| Fin height | 18 mm |
| Base thickness | 2.0 mm |
| Base flatness | 0.05 mm over 100 mm |
| Thermal resistance | 0.35 K/W |
| Thermal test condition | ΔT = 60 K, natural convection |
| Surface finish | black anodize Type II, 10-15 µm |
| Size range | 120 x 80 x 22 mm |
Yes. Send a drawing or a sample and we return a DFM note within 3 working days. Most 1U server and AI accelerator customisations change 1.5 mm, 2.0 mm or the hole pattern, and all three are tooling changes on the existing 160 T press rather than a new machine.
6063-T5 aluminium is the standard choice. For 1U server and AI accelerator in a corrosive environment we specify 6063-T5 with black anodize Type II, 10-15 µm; for the highest conductivity we move to copper C110, which raises cost and weight but drops thermal resistance by roughly half at the same envelope.
We test at ΔT = 60 K, natural convection and report 0.35 K/W. That is a steady-state figure, not a transient: for 1U server and AI accelerator first-power-on behaviour you need a different test, and we can run it on request.
With 0.3 mm fins and standard PE bag + export carton, 20 kg per carton, damage is rare. For heavy sea routes or automated handling we suggest double-layer interleaving, which we can specify at no tooling cost. We have shipped 300,000 pcs per month this way without a transit claim in the last 3 years.
We supply a 2D drawing with the CMM report, and 3D STEP on request. Both show flatness callouts and tooling split lines, which matters if you are checking 0.05 mm over 100 mm in your own assembly.
The line sits in Dongguan in a single ISO9001 plant. 160 T presses cover the 1U Server Stamped Fin Heatsink Assembly family, and 300,000 pcs per month is current committed output.
Source-direct from Dongguan: coil stock, forming, surface treatment and inspection happen in one building, so 0.05 mm over 100 mm flatness is verified before the part is packed.
We quote FOB Shenzhen and hold 100 pcs for sampling. Sampling is free sample with drawing, 5-7 days, so a first evaluation does not require a production commitment.
Further technical detail: Custom Industrial Heat Sinks Precision Manufacturing No MOQ China.
Request a quote: sc@bquq.com | WhatsApp +86 13713157787 | Dongguan, China
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| Parameter | Value / Range |
|---|---|
| Material | 6063-T5 aluminium |
| Tolerance | 0.05 mm over 100 mm; fin pitch ±0.03 mm; hole position ±0.10 mm |
| Lead time | Standard for this process; confirmed at order |
| MOQ | Standard for this process; confirmed at order |
| Capacity | 300,000 pcs per month; 8 s cycle |
| Option | Best for | Trade-off |
|---|---|---|
| Stamped fin heatsink | 1U server and AI accelerator volume programs | Requires 160 T tooling; fin gauge limited to thin sheet |
| Extruded heatsink | Simple profiles with thicker fins | Cannot hold 0.3 mm fin profile; pitch varies with die wear |
| Machined heatsink | Low-volume or complex 3D features | Higher part cost; more surface per cubic millimetre is lower than stamped |
| Stamped construction | Repeatable ±0.10 mm hole position across batch | Die wear shows first as measurable fin pitch shift |
| 160 T stamping line | 300,000 pcs monthly output | Part cost stops scaling with complexity but tooling runs ±0.03 mm |
| Stage | Control | Record |
|---|---|---|
| Stamping | 160 T stroke forms whole assembly; 8 s cycle | Tooling runs ±0.03 mm |
| Fin forming | Die forms every fin in one stroke; pitch within ±0.03 mm | Measurable shift in fin pitch from die wear |
| Dimensional check | CMM 0.001 mm with full report | 0.05 mm over 100 mm; ±0.10 mm hole position |
| Batch release | Inspection before every shipment | Full report per shipment |
| Thermal performance | 0.35 K/W at ΔT = 60 K, natural convection | Verified on 2.0 mm base and 0.3 mm fins |
The die forms every fin in one stroke, so pitch stays within ±0.03 mm across a 300,000 pcs run. Tooling runs ±0.03 mm, and die wear shows up first as a measurable shift in fin pitch, which CMM inspection at 0.001 mm catches before shipment.
It returns 0.35 K/W at ΔT = 60 K, natural convection. The 2.0 mm base and 0.3 mm fins pressed from 6063-T5 aluminium on 160 T tooling give more surface per cubic millimetre than a machined or extruded profile of the same envelope.
Monthly output runs at 300,000 pcs. A single 160 T stroke forms the whole assembly in an 8 s cycle, so part cost stops scaling with complexity. Every stroke is dimensionally identical, which makes 1U server and AI accelerator volume programs repeatable.
Every stroke is dimensionally identical, so ±0.10 mm hole position carries across the batch. Tooling runs ±0.03 mm, and inspection before every shipment uses CMM 0.001 mm with a full report rather than relying on field checks.
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Stamping gives a repeatable 0.3 mm fin profile that extrusion cannot hold. The die forms every fin in one stroke, so pitch stays within ±0.03 mm across a 300,000 pcs run. Low fin gauge at 1.5 mm pitch gives more surface per cubic millimetre than an extruded profile of the same envelope.
It is pressed from 6063-T5 aluminium on 160 T tooling. The 2.0 mm base and 0.3 mm fins are formed in one stroke. Tooling runs ±0.03 mm, and the 8 s cycle feeds a 300,000 pcs line with 0.05 mm over 100 mm dimensional control.
Die wear shows up first as a measurable shift in fin pitch. Inspection catches it at CMM 0.001 mm with a full report rather than in the field. This keeps the 0.3 mm fin profile and ±0.03 mm pitch within specification across the 300,000 pcs run.
| Parameter | Value / Range |
|---|---|
| Material | 6063-T5 aluminium |
| Tolerance | 0.05 mm over 100 mm; fin pitch ±0.03 mm |
| Lead time | Standard for this process: 15–25 days after tooling approval |
| MOQ | Standard for this process: 5,000 pcs |
| Capacity | 300,000 pcs per month; 8 s cycle |
| Option | Best for | Trade-off |
|---|---|---|
| Stamped fin heatsink | High-volume 1U server cooling with 0.3 mm fins at 1.5 mm pitch | Tooling upfront cost; less design flexibility than machining |
| Extruded heatsink | Lower-volume runs with simpler fin profiles | Cannot hold 0.3 mm fin profile; pitch variation higher than ±0.03 mm |
| Machined heatsink | Prototypes or very complex geometries | Higher part cost; slower cycle than 8 s; more material waste |
| Bonded fin heatsink | Mixed materials or very tall fins | Thermal interface resistance; additional assembly step |
| Skived fin heatsink | Fine pitch on copper or aluminium | Higher cost per part; limited to certain alloys |
The assembly returns 0.35 K/W at ΔT = 60 K under natural convection. This value is based on a 2.0 mm base and 0.3 mm fins pressed from 6063-T5 aluminium. Actual performance depends on airflow and mounting pressure, so verify in your specific server enclosure.
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Fin pitch stays within ±0.03 mm across a 300,000 pcs run. The 160 T tooling forms every fin in one stroke, which eliminates cumulative pitch drift. This repeatability is why stamping is chosen over extrusion for 0.3 mm fins at 1.5 mm pitch.
Monthly output reaches 300,000 pcs with an 8 s cycle. The 160 T press runs the complete assembly in a single stroke. This capacity supports high-volume server programs without sacrificing the ±0.03 mm fin pitch tolerance.
The heatsink uses a 2.0 mm base and 0.3 mm fins pressed from 6063-T5 aluminium. This alloy offers good thermal conductivity and formability for stamping. The 2.0 mm base provides structural rigidity for 1U server mounting.
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The base holds 0.05 mm over 100 mm. Flatness ensures consistent contact with the CPU or GPU lid, which directly affects thermal resistance. A flatter base reduces interface gaps and helps achieve the rated 0.35 K/W at ΔT = 60 K.
For this process, standard lead time is 15–25 days after tooling approval, and MOQ is 5,000 pcs. Tooling fabrication adds 3–4 weeks initially. Once tooling is complete, the 8 s cycle supports 300,000 pcs per month.
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Stamping gives a repeatable 0.3 mm fin profile that extrusion cannot hold. At 1.5 mm pitch, stamped fins provide more surface per cubic millimetre than machined or extruded profiles. The 160 T single-stroke process also keeps part cost from scaling with complexity.
It returns 0.35 K/W at ΔT = 60 K under natural convection. This value is measured on the 2.0 mm base and 0.3 mm fin assembly pressed from 6063-T5 aluminium. Performance depends on airflow and mounting pressure, so confirm your exact conditions with our engineering team.
Fin pitch stays within ±0.03 mm across the full 300,000 pcs monthly run. The 160 T die forms every fin in one stroke, so the 0.3 mm profile repeats without the drift seen in extrusion. We verify pitch at first-off and during in-process checks.
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Standard lead time for this process is 15–25 days after drawing approval, including 160 T tooling fabrication and first-article inspection. Production then runs at an 8 s cycle and 300,000 pcs per month. Rush options may be available depending on tool capacity.
Standard MOQ for this process is 5,000 pcs. Because the 160 T die forms the whole assembly in one stroke, unit cost drops at higher volumes. Monthly capacity reaches 300,000 pcs, so we can scale with your forecast.
Yes. The assembly holds 0.05 mm over 100 mm, verified by CMM inspection before shipment. This flatness supports consistent contact with the server CPU and helps maintain the 0.35 K/W thermal resistance at ΔT = 60 K under natural convection.
Stamping gives a repeatable 0.3 mm fin profile that extrusion cannot hold. The die forms every fin in one stroke, so pitch stays within ±0.03 mm across a 300,000 pcs run. Extrusion is better for taller fins and lower volumes, but not for this thin, dense pitch.
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We use 6063-T5 aluminium for the 2.0 mm base and 0.3 mm fins. Standard surface finish for this process is clear chromate or anodize, but we confirm finish per your drawing. Material and finish are recorded on the inspection certificate.
| Parameter | Specification |
|---|---|
| Material | 6063-T5 aluminium |
| Fin thickness | 0.3 mm |
| Fin pitch | 1.5 mm |
| Fin height | 18 mm |
| Base thickness | 2.0 mm |
| Base flatness | 0.05 mm over 100 mm |
| Thermal resistance | 0.35 K/W |
| Surface finish | black anodize Type II, 10-15 µm |
| Monthly capacity | 300,000 pcs |
| MOQ (prototype) | 100 pcs |
| Lead time (production) | 12 working days |
| Size range | 120 x 80 x 22 mm |
